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AEPC Z3 is a liquid metal thermal interface compound for compatible desktop PC, laptop and PS5 repairs. Each unit contains 1g in a syringe for controlled application. Choose 1, 5 or 10 units for individual repairs or workshop use.
The kit photo also shows soft-pack accessory sachets labelled "Thermal Compound". Pack Size refers to the number of 1g liquid metal syringes.
We recommend Z3 for professional PS5 APU thermal-interface servicing where compound suitability and contact surfaces have been checked. The original PS5, PS5 Slim and PS5 Pro use liquid metal between their main processor and cooling assembly.
Inspect the specific console model, prepare the contact area and preserve its original insulation and liquid-metal containment barriers. Apply a controlled amount to the intended APU interface and check for stray material before reassembly. The supplied gasket does not replace the console's original protective structure. Thermal pads and gap-filling putty elsewhere in the console remain separate materials.
Check the exact device and cooling assembly before use. Cooling performance depends on surface preparation, application, contact pressure, airflow and device condition.
Learn about the PS5 family's liquid-metal cooling design in PlayStation's official teardown.
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